Mr. Vance Liu | Solder Joint Reliability | Best Researcher Award 

Micron Technology | Taiwan 



Wen-Ju (Vance) Liu's academic journey in Materials Science and Engineering began with a Bachelor's degree from National Cheng Kung University (NCKU) in Tainan, Taiwan, graduating with a commendable GPA of 3.5/4.0 in May 2016. He then pursued a Master of Engineering degree at the prestigious Whiting School of Engineering, Johns Hopkins University, where he conducted fundamental research at the Hopkins Extreme Materials Institute (HEMI) and collaborated with Prof. Weihs' group from January 2017 to May 2018.


Liu's professional trajectory includes significant roles at Micron Technology Incorporation, where he has been employed since 2019. Starting as a Characterization Engineer, he advanced to the position of Sr. Package Characterization Engineer in 2023. His responsibilities encompass material characterization and board-level reliability for NPI memory products, collaborating with the technology development team for materials selection, second sourcing, and enhancing reliability and thermal-mechanical performance. Additionally, he assists in assessing the DRAM and NAND chip package integrity for Taichung and Singapore sites.


Wen-Ju Liu's research focus during his time at Hopkins Extreme Materials Institute (2018-2019) and his subsequent professional roles highlight his dedication to advancing material science. His summer internship at Corning Asia Incorporation in 2019 involved researching and simulating the addition of cBN ceramics into new Iris glassR to improve transmittance values. This work resulted in filing and publishing a restricted technical report on the cBN on Iris glassR forming process.

Liu's technical expertise is further demonstrated through his proficiency in various programming languages, computational software, and lab hardware, including Matlab, JMP, OriginLab, AutoCAD, transmission electron microscopy, scanning electron microscopy, atomic force microscopy, and other advanced material characterization techniques.


  • Citations  54
  • h-index    3
  • i10-index 1


Liu's contributions have a significant impact on the field of material science, particularly in the context of solder joint reliability. His work at Micron Technology on enhancing thermal-mechanical performance and reliability directly influences the durability and efficiency of electronic components, essential for the advancement of memory products. His involvement as a technical reviewer for high-impact journals such as Springer and Elsevier further underscores his influence in the academic community, where he provides critical insights and evaluations of emerging research in materials science.


As a recognized expert in his field, Wen-Ju Liu serves as a technical reviewer for several reputable journals, including the Journal of Materials Science: Materials in Electronics, Elsevier Memories, Materials, Devices, Circuits, and Systems, and Elsevier e-Prime-Advances in Electrical Engineering, Electronics and Energy. His academic contributions are frequently cited by peers, reflecting the value and relevance of his research to ongoing developments in material science and engineering.


Looking to the future, Wen-Ju Liu aims to continue his contributions to the field of material science with a focus on solder joint reliability, an area critical to the longevity and performance of electronic devices. By pushing the boundaries of material characterization and reliability assessments, he aspires to further technological advancements and support the development of more robust electronic packaging solutions. His ongoing professional activities, including his role as an IEEE Member and recipient of the IEEE-EPS certificate for young professionals, highlight his commitment to excellence and continuous professional development.


Throughout his career, Liu has emphasized the importance of solder joint reliability in electronic packaging. His work at Micron Technology involves meticulous material characterization and performance enhancement, which are crucial for ensuring the integrity of solder joints under various operational stresses. By focusing on this critical aspect, Liu contributes to the development of more reliable and durable electronic components, thereby supporting the broader goals of technological innovation and sustainability in the electronics industry.


Vance Liu | Solder Joint Reliability | Best Researcher Award 

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