Seoul National University of Science and Technology | South Korea
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Early Academic Pursuits
Dr. Le Bach’s academic journey began at Hanoi University of Science and Technology, where he earned his Bachelor’s degree in Mechanical Engineering in 2019. His early research explored 2D low-dimensional materials with hexagonal structures for artificial muscles, highlighting his interest in advanced material science and mechanics. He continued at the same institution for his Master’s degree (2021), focusing on actuator properties of two-dimensional materials for robotic arm applications, combining materials engineering with robotics. In pursuit of higher excellence, he obtained his Ph.D. at Seoul National University of Science and Technology in 2025, with a dissertation on “Assessment and Prevention of Crack Formation in 2.5D Glass Interposer and Hybrid Bonding Structure.” This work laid the foundation for his expertise in semiconductor packaging.
Professional Endeavors
Dr. Le Bach has accumulated diverse professional experiences bridging industry and academia. As a Postdoctoral Researcher at the MEMS and Packaging System Lab (2025–present), he focuses on structural and thermal analysis for advanced semiconductor packaging. Earlier, he worked as a research student (2019–2021) at the International Institute for Computational Science and Engineering, specializing in nanomechanics and the dynamic stability of 2D materials. His industry experience includes roles at Maxflow Technology Vietnam (2018–2021) in structural analysis, lifetime prediction, and optimization, and Showa Auto Parts Vietnam (2017–2018), where he contributed to mold design, flow simulation, and product development. These combined endeavors enriched his applied knowledge in semiconductor packaging technologies.
Contributions and Research Focus
Dr. Bach’s research focus centers on mechanical numerical simulations, structural analysis, and thermal performance assessments of semiconductors and electronic devices. He has contributed to the lifetime prediction and reliability assessment of microelectronic components and advanced structural optimization techniques. His research in vibration analysis for gyroscope sensors further expands his portfolio in sensor technology. His pioneering contributions toward preventing crack formation in interposers and hybrid bonding structures are highly relevant to reliability in semiconductor packaging.
Impact and Influence
Dr. Bach has made an impact by bridging fundamental research in 2D materials with applied challenges in semiconductor and electronic device reliability. His studies on structural and thermal performance provide valuable insights for industry practices, especially in the development of reliable semiconductor packaging systems. His interdisciplinary expertise influences both academic research communities and industrial R&D in Vietnam, Korea, and beyond.
Academic Cites
Although at the early stage of his academic career, Dr. Bach’s contributions are gaining recognition in the scientific community. His doctoral dissertation and published works on 2D materials and advanced packaging structures have already become reference points for scholars working on material reliability and semiconductor packaging performance. His academic trajectory suggests that his citation count and recognition will continue to grow in the coming years.
Legacy and Future Contributions
Dr. Bach is poised to make lasting contributions in the realm of semiconductor packaging by developing novel approaches for structural optimization, crack prevention, and lifetime assessment of advanced electronic devices. His future work aims to refine predictive models for electronic device reliability and contribute to the next generation of energy-efficient, reliable, and miniaturized devices. Additionally, through mentorship and collaboration, he will inspire future researchers in the intersection of materials science, mechanics, and semiconductor technologies.
Publications
X.L. Le, X.B. Le, Y. Hwangbo, J. Joo, G.M. Choi, Y.S. Eom, K.S. Choi, S.H. Choa (2023). "Mechanical reliability assessment of a flexible Package fabricated using laser-assisted bonding" in Micromachines
X.B. Le, S.H. Choa (2024). "A comprehensive numerical analysis for preventing cracks in 2.5D glass interposer" in Journal of Mechanical Science and Technology
X.B. Le, S.H. Choa (2024). "Assessment of the Risk of Crack Formation at a Hybrid Bonding Interface Using Numerical Analysis" in Micromachines
L.X. Bach, V. Van Thanh, H. Van Bao, D. Van Truong, N.T. Hung (2021). "Electromechanical Properties of Monolayer Sn-Dichalcogenides" in Modern Mechanics and Applications: Select Proceedings of ICOMMA 2020
V. Van Thanh, N.T. Dung, L.X. Bach, D. Van Truong, N.T. Hung (2021). "Turning Electronic and Optical Properties of Monolayer Janus Sn-Dichalcogenides By Biaxial Strain" in Modern Mechanics and Applications: Select Proceedings of ICOMMA 2020
Conclusion
Dr. Le Bach represents a new generation of scholars whose work connects fundamental material science with the applied engineering challenges of modern electronics. With expertise in semiconductor packaging, structural analysis, and reliability assessment, his career promises impactful contributions to both academic and industrial advancements. His balanced background in academia and industry ensures a legacy that will continue shaping innovations in electronic device performance, reliability, and sustainability.